Wafer Level Processing
Flip Chip Solder Bumping
Broad industry expertise in all solder and Cu pillar wafer bumping RDL and UBM technology options used for fine pitch, high I/O flip chip in package applications or Wafer Level Packaging with a solid track record of successful OSAT deployments and HVM
Fine Pitch Cu Pillar Bumping
Cu pillar bumping process development for ultra-fine pitch flip chip on lead applications (sub-50 to 150 micron pitch) and extensive module miniaturization assembly experience
WLP Process & Materials Development
Broad materials and process development Open Innovation within WLP and traditional IC packaging industry segments to accelerate and optimize advanced packaging solutions
WLP Facility Planning & Process Equipment Consulting
Proven skills in successfully transferring WLP technologies including on-site participation in equipment set decision making and factory planning for both green field and capability expansions within existing OSAT factories
Heterogeneous Integration
Diverse Fab - OSAT process integration involvement in 2, 2.5 , 3D and WLP based heterogeneous packaging innovation