Global Technology Engineering Management
Semiconductor Packaging Technology Road-mapping
Leverage our knowledge base and extensive advanced packaging experience for customer specific road-mapping and path-finding for unbiased competitiveness assessments and strategic planning for timely interception of emerging industry mega-trends
Foundry & OSAT Process Integration Management
Leverage our experienced, hands-on IC packaging experts to compliment your internal engineering resources during planned or unexpected peaks in project activities in your foundry and OSAT process integration efforts
IC Packaging Factory Integration and Construction Oversight
Leverage our extensive process engineering experience to assist in your strategic IC packaging to volume manufacturing efforts, from initial factory planning thru to successful onsite factory completion
Advanced Packaging Equipment Selection
The decades long experience of our Gordian team and industry affiliates can assist you in all of your critical / costly WLP and advanced packaging assembly equipment decision-making
On Site or Remote Program Management
By accessing our Global IC packaging program management services to compliment your internal engineering resources, critical time-sensitive development and manufacturing projects with on-site , remote or highly adaptable hybrid real/virtual program oversight, can ensure successful outcomes, again and again...
New Product Introduction, Qualification and Volume Production Scale-Up
Compliment your internal resources with highly skilled, but temporary Gordian IC packaging support to ensure success during hectic, time - critical NPI and production launches or to quickly and effectively address unexpected quality or reliability
supply chain glitches