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Over the last 25+ years, Ted Tessier has established exceptional friendships and working relationships across the globe, within the semiconductor industry. With an impeccable reputation for technology development on the leading edge of advanced packaging for more than 3 decades, Ted is an expert in technology transfers and concurrent engineering of packaging solutions to meet or exceed the performance and miniaturization requirements of emerging product applications.  He has made IC contributions to virtually all electronic product application segments and has made lasting industry recognized contributions in the area of flip chip assembly, Fan-In and Fan-Out WLP/PLP solutions.  Ted has published more than 100 papers and articles on packaging material selection and optimization, process development and package reliability.  He is equally experienced in successfully overseeing packaging equipment selection, factory planning and realization efforts in locations around the world.  Throughout his career, Ted has actively participated in consortial packaging programs at international research institutes including the Fraunhofer IZM (Germany), IMEC (Belgium), the IME  (Singapore) and Research Triangle Institute / MCNC (USA).  He has C-Level and BOD experience with international companies abroad and in North America and has also led mergers  and acquisition efforts in Japan, Singapore, South Korea, Malaysia and China.  

Ted has the reputation and international name recognition in our industry to help elevate your company and enable lucrative Open Innovation opportunities.  Ted's founding of  Gordian Semiconductor Packaging Solutions (Gordian-GPS), a global  IC Packaging engineering firm located in Gilbert, Arizona  in August 2017 was the realization of a career long goal.   It has enabled  him to continue his global strategic packaging technology efforts, while also providing gratifying opportunities to work for  clients to increase their domestic semiconductor packaging supply chainself-reliance needs.

If you are interested in seeing a detailed resume of past experience and accomplishments or discussing how we can support any of your current or emerging advanced packaging requirements, please contact us.