IC Packaging Supply Chain Development
Global OSAT Supplier Development
Proven successes in global OSAT NPI and product qualification (remote or on-site) program management services for foundry and OEM clients
North American Advanced Packaging Self-Reliance
Provide North American supplier development and engineering support for customers that must have domestic packaging assembly sources to support their core businesses and/or cannot rely exclusively on overseas OSATs for security of supply
Laminate IC Packaging Substrate Supplier Development
Leverage global industry contacts with Tier 1 substrate suppliers through Open Innovation to enable clients to source and qualify high density, quality and reliability laminate substrates to meet or exceed their IC packaging requirements
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Volume Production Support & Issue Resolution
Manage OSAT outsourced package assembly business for foundry and OEM customers from NPD, through NPI and to end of life including qualification and HVM supply chain management
Material Supplier Selection & Process Optimization
Leverage our network of Open Innovation packaging experts to provide IC packaging material options and process engineering leadership for foundry and/or OSAT clients