Ted Tessier, CEO
Ted is the Founder and Chief Technologist of Gordian Semiconductor Packaging Solutions, a subsidiary of Gordian International LLC located in Gilbert, Arizona, a semiconductor packaging and international engineering management firm with a global client base. He is highly influential in advanced packaging technology circles in areas including Wafer Level Packaging, high density PWB technologies, Fan-In & Fan-Out WLP and PLP technologies, flip chip and Cu pillar bumping and assembly, MEMS and Sensor packaging as well as heterogeneous integration. He has managed global engineering organizations at executive levels for more than 20 years. He specializes and practices Open Innovation strategies, has a proven track record of successfully driving technology innovations into global OSAT factories, an outstanding record of managing seamless New Product Introduction efforts and extensive experience in overseeing technology creation and international intellectual property management and monetization.
Ted has 25+ years of industry experience, has published more than 150 conference papers and journal publications, and has 12 United States patents issued in a wide range of advanced packaging areas. He also has broad interests and involvement in leading edge packaging solutions for Artificial Intelligence, 5G, Medical Electronics, Lab on a Chip, Genomics, Internet of Things (IoT, MEMS / Sensors) and Technology Investment Strategies including technology due diligence for Semiconductor related Mergers and Acquisitions.
Ted graduated with a BSc. Degree in Biochemistry from Laurentian University, Sudbury Ontario and a Master’s degree in Applied Polymer Chemistry from the University of Ottawa, Ottawa, Ontario, Canada.
Areas of Expertise and Proven Success
- Processing (WLP) Process & Materials Development
- Post-Passivation Process Development including Flip Chip & Cu Pillar Bumping
- Flip Chip in Package & Surface Mount Module Assembly
- OEM Assembly Engineering Management Expertise
- Back-End Wafer & Die Processing
- Demonstrable Global Technology Transfer Successes
- Extensive Program Management
- FI/FO-WLP Technologies
- Heterogeneous Integration
- Mixed Technology Stacked Die Packaging
- Design & Sourcing of High Density Packaging Substrate Solutions
- Proven Multidisciplinary Management Experience and Skills
- Customer & Factory Technical Interfacing Skills
- ITAR Certification and Management Experience
- Verbal & Written Communication Skills
- IC Packaging Road-Mapping & Realization
- Engineering Mentoring & Coaching Skills
- Mergers and Acquisitions
- Intellectual Property Creation & Management
- Extensive Hands-on Expertise in Advanced IC Packaging Failure Analysis
- Process Troubleshooting Skills
Testimonials
Ted is well known in the semiconductor industry as a top notch advanced packaging technologist. I've know him since he hired me to work in the Advanced Semiconductor Interconnect Laboratory at Motorola Semiconductor in the late 1990's. There Ted led the development and production launch of one of the first flip-chip CSP package technologies. Over the years since I've had the pleasure of collaborating with Ted on several projects. Ted has very good technical judgement and is a very capable manager. He has deep knowledge of advanced packaging technologies, particularly flip-chip, wafer level packaging and SiP. I would recommend him for any project requiring technical leadership in semiconductor packaging.
- Chris Scanlan
Ted has been a friend, colleague, and mentor of mine since 1994. We first met when he was working at Motorola Corporate Research studying the first underfills to be used in flip chip packaging. We then worked together at Motorola Semiconductor Product Sector in Tempe, Arizona where Ted was known as our FC-CSP bump and assembly expert. After starting at Mot, Ted encouraged me to get involved in industry activities as he saw the value of networking and keeping up on the latest published work. Since then, Ted has become a premier expert on WLP and FO-WLP technologies for the consumer, mobile and IoT markets. Ted is also a technical management leader who was CTO of FC International for many years. I value Ted's insights and advice into new technologies and always look forward to seeing him and discussing the latest packaging innovations at industry events.
- Beth Keser, Ph.D.
I had the privilege of working with Ted for 10 years at FlipChip International and then Huatian Technology. Ted was an ideal CTO. He truly knew the semiconductor industry form silicon to front-end processing to back-end assembly. He had a keen sense of direction on where the technologies and developments for each of these areas was headed. Our company significantly benefited from his overall expertise as he incorporated his knowledge into the technology ology roadmap and then helped drive the development of these programs. To name a few he was directly responsible for bringing in-house processes which enabled electroless Ni/Pd/Au Cu Pillar bumping and significant improvements in wafer level packaging. He was a very effective leader and mentor to the Process R&D, Reliability, and other Engineering Groups he managed. Ted was very effective at working with key customers coordinating technology development and moving this through to high volume production. He meticulously managed and coordinated the development of the Intellectual Property of the company. T%edf was a respected member of the senior staff and helped FlipChip and Huatian continue to grow, develop and be successful in the industry.
- Guy Burgess