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  • Technology Services
    • IC Packaging Application
    • Wafer Level Processing
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    • Supply Chain Management
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    • Other Consulting Areas
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    • Home
    • About
    • Technology Services
      • IC Packaging Application
      • Wafer Level Processing
      • Package Engineering
      • Supply Chain Management
      • Engineering Management
      • Other Consulting Areas
    • Photo Gallery
    • Contact Us
  • Home
  • About
  • Technology Services
  • Photo Gallery
  • Contact Us

Other Consulting Areas

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Intellectual Property Creation and Management

With more than 25 years of advanced packaging intellectual property development and management experience including global IP filing oversight, IP protection, IP licensing and technology transfers, the "Gordian Team" and  our affiliated industry experts  can provide outstanding client support in any of these critical business areas

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International Technology Licensing & Transfers

Demonstrated 100% success rate in Global technology transfers of licensed advanced packaging intellectual property and know how to green field or capability expansion-driven factory scnarios 

(includes successful  transfers to all of the industry's Tier 1 OSATS)

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Technology Due Diligence - Mergers & Acquisitions

Demonstrable experience in semiconductor packaging technology and manufacturing due diligence, asset / capability and technical valuation improvement for Venture Capital raises as  well as              

Mergers and Acquisitions

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IC Packaging Intellectual Property Litigation and Expert Witness Services

Career long experience in leading IP litigation and defense efforts, extensive knowledge of  all major IP advanced semiconductor packaging technology landscapes enabling highly effective Expert Witness client representation

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Open Innovation, Relationship Building and Leveraging

Extensive Global semiconductor industry contacts and  highly respected industry reputation across all advanced packaging market segments facilitates Open  Innovation based strategic collaboration with exceptional client benefits and value

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IC Packaging Quality and Reliability Engineering Management

Breadth of semiconductor packaging experience  and technology options provides our client base with unsurpassed supply chain quality and reliability issue resolution support when needed


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