IC Packaging Applications
Medical Electronics
Broad experience in implantable medical electronics , hearing aid modules , high resolution medical imaging and MEMS packaging form factor minimization
Military Electronics
Extensive experience in flip chip package development for high reliability, military electronics applications
Computing & Communication Electronics
High Performance flip chip BGA module materials and assembly consulting for 5G infrastructure
Mobile Phones & Wearable Electronics
Development & HVM of advanced packaging for Smart Phone applications including Fan-In and Fan-Out WLPs,
Stacked Die Packaging and 3D Package on Package Solutions
Automotive Electronics
NPI experience in ruggedizing and successfully qualifying FO-WLP semiconductor packaging technologies to stringent emerging ADAS automotive application specifications
Internet of Things / Smart Cities / Smart Homes
Extensive experience in developing and deploying application specific packaging solutions for IoT MEMS and sensor applications